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Novel nano composite polymers and joining technologies for reliable and efficient assembly of electronic components

Acronym: NANOJOINING
Start: 4/1/2002
End: 9/30/2005
Homepage: http://cordis.europa.eu/data/PROJ_FP5/ACTIONeqDndSESSIONeq112242005919ndDOCeq1511ndTBLeqEN_PROJ.htm

Project Status History
progressing4/1/2002
 
Abstract
The aim of this project is to develop new materials and processing techniques for bonding and underfilling of flip chips and bonding of heatsinks in order to realise a step improvement in flip chip technology and to allow a further minituarisation (in the design) of microelectronic products. The goals are: a reduction of 40% in size, weight, material consumption and power consumption of various products like mobile telecommunication equipment, computers, monitors, controller units for automotive applications, etc. Targeted developments are: 1) new underfill materials containing nano size fillers with superior properties; 2) new electrically and/or thermally conductive adhesives; 3) a transfer moulding process capable of underfilling flip chips in mass volumes (e.g. 200 in one pass) at low costs; 4) an inkjet dispensing technique for electrically and thermally conductive adhesives.

 
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