|The aim of this project is to develop new materials and processing techniques for bonding and underfilling of flip chips and bonding of heatsinks in order to realise a step improvement in flip chip technology and to allow a further minituarisation (in the design) of microelectronic products. The goals are: a reduction of 40% in size, weight, material consumption and power consumption of various products like mobile telecommunication equipment, computers, monitors, controller units for automotive applications, etc.
Targeted developments are:
1) new underfill materials containing nano size fillers with superior properties;
2) new electrically and/or thermally conductive adhesives;
3) a transfer moulding process capable of underfilling flip chips in mass volumes (e.g. 200 in one pass) at low costs;
4) an inkjet dispensing technique for electrically and thermally conductive adhesives.