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Anisotropic Conductive Film Die Bonder Assessment

Acronym: AFIDA
Start: 1/1/2000
End: 6/30/2001
Homepage: http://cordis.europa.eu/data/PROJ_FP5/ACTIONeqDndSESSIONeq112422005919ndDOCeq256ndTBLeqEN_PROJ.htm

Project Status History
completed1/1/2000
 
Abstract
The overall objective of the project is to evaluate and improve the performance of a prototype flip-chip die bonder dedicated to assembly processes using anisotropic conductive films (ACF). This prototype is designed by CYBERNETIX for high volume and low cost assembly of miniaturised SAW filters used in mobile phones, but is compatible with a wide range of applications. THOMSON MICROSONICS, the principal end user of this equipment, will carry out a specific and detailed evaluation of the machine for this application. A second end user CELESTICA will participate actively in the assessment of this equipment for a broad range of applications and process parameters. Both end users will provide inputs for an improvement of the current prototype. Exchange and dissemination of results to promote ACF processes and equipment will be an integral part of the project. Objectives: The overall objective of the AFIDA project is to evaluate and improve the performance of a European-made prototype flip-chip bonder especially dedicated to assembly processes using anisotropic conductive films (ACF). The equipment will be targeted towards high volume and low cost assembly at THOMSON MICROSONICS of miniaturised Surface Acoustic Wave (SAW) filters used in mobile phones, but will be compatible with a wide range of applications which will be covered by CELESTICA. Both end users will assess the effectiveness of equipment performances and will provide inputs for an improvement of the current prototype. The availability of this equipment will make possible the industrial implementation of advanced assembly technologies and will promote the use of ACF materials for future generation products. Work description: (WP1): The two end users will provide equipment specifications according to their respective applications. The supplier will build accordingly a prototype ACF flip-chip bonder equipment starting from modules already (WP1): The two end users will provide equipment specifications according to their respective applications. The supplier will build accordingly a prototype ACF flip-chip bonder equipment starting from modules already available. All necessary adaptation will be made to meet both end users needs. A factory acceptance test with the users will end this workpackage. (WP2): This equipment will be installed at THOMSON MICROSONICS in a near to production environment in a specialised service dedicated to back-end fabrication machine assessment. A first phase assessment will be conducted by TMX with specially designed test parts corresponding to real high volume applications for miniaturised SAW filters (Flip-chip in ceramic package and Chip-size package). This first evaluation will provide initial conclusion on equipment performances as well as inputs for an improvement by the supplier. The final assessment for SAW filters will be conducted against the highest final target specifications. Process effectiveness as well as reliability and throughput performances will be assessed. CELESTICA will participate to these assessment and improvement phases. (WP3): After minor modifications, TMX will provide access to the assessment site as well as other equipment and personal assistance to the second user. The equipment will be assessed by CELESTICA with its own test parts for a wider range of applications and for a wider range of ACF materials and process parameters (Flip-chip on board with different board sizes and designs). (WP4): Intermediate and final results will be exchanged and disseminated at different levels and through existing or dedicated channels. A technology implementation and commercial exploitation plan for the equipment will be established.

 
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