|Adhesive conductive pastes (ACP) used for assembling micro-modules to RF antennas of dual interface smart cards (contact and RF contact less) require oven curing before becoming conductive. This prevents cards from being function tested "in-line" and can result in card body distortion. The project aims to develop/characterise/qualify new adhesive conductive pastes/processing routes/equipment for complete " in-line" production and testing of cards. A model for predicting adhesive bond properties will be developed. The scientific phenomena of micro-wave curing will be explored. The project will reduce scarps rates, improve product reliability, consolidate European leadership and employment in smart cards, open new avenues in electronic packaging and reduce the use of lead. It will promote citizen services (IST) using cost effective and reliable smart cards.